AMD samples XQRVC1902 space-grade adaptive SoC to space customers
10/03/2026 — 10/03, 18:49·1 sources·1 reports
Story overview
AMD has announced that it is delivering early samples of its Versal AI Core XQRVC1902 adaptive SoC to space customers. The announcement was made on October 1 local time and was reported by IT之家 on October 3.
The XQRVC1902 uses a space-grade lidless package developed in-house at AMD. According to the company, the package combines conservative design rules with enhanced organic substrate materials and space-grade chip capacitors. AMD says that combination reduces the thermal and mechanical stress the space environment places on the chip, making it suitable for space missions with especially demanding reliability requirements. The report did not include compute specifications, a production schedule, or the names of the customers receiving the samples.
AMD is currently testing the Versal AI Core XQRVC1902 adaptive SoC against the U.S. military standard MIL-PRF-38535 Class Y, which the company describes as the highest level of quality and reliability among space component standards.
AI-generated from 1 reports · updated 2 hours ago
Latest turnAMD has shipped early samples of the Versal AI Core XQRVC1902 adaptive SoC to space customers. The chip uses a space-grade lidless package and enhanced organic substrate materials to reduce thermal and mechanical stress in orbit, and is being tested against the MIL-PRF-38535 Class Y standard.
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AMD has shipped early samples of the Versal AI Core XQRVC1902 adaptive SoC to space customers. The chip uses a space-grade lidless package and enhanced organic substrate materials to reduce thermal and mechanical stress in orbit, and is being tested against the MIL-PRF-38535 Class Y standard.
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