Samsung says 2027 HBM capacity sold out, HBM4 hits 60% of HBM revenue

On October 29, 2026, Bloomberg reported that Samsung Electronics expects this year's capital expenditure to grow by around 60%, reaching approximately $63B, after its high-end chip capacity for 2027 sold out. The company said it had secured 10 long-term supply deals with key customers and that the shortage of high-end memory chips would persist for several years.

Later the same day, IT之家 reported on Samsung Electronics' 2026Q3 earnings call, held that morning local time. Executives said the company's 2027 HBM capacity had sold out at established target prices, and that overall DRAM supply would remain tight through 2028. In 2026Q3, Samsung's DRAM and NAND shipment volumes both rose by single-digit percentages, while ASP grew 20% for DRAM and nearly 10% for NAND. The company expects DRAM shipment volume to increase 15~20% in 2026Q4, and NAND by around 15%. Although the memory semiconductor market remains oversupplied overall, executives noted they were receiving substantial QLC demand.

On long-term agreements, Samsung's memory business has signed LTAs with 10 customers and is negotiating multi-year contracts with another 10. As interest extends to mobile, automotive, and networking sectors, Samsung is steadily advancing plans to lock in 60~70% of output through multi-year contracts, and demand for rolling renewals has exceeded expectations, with some customers seeking additional supply during the contract term. In HBM, Samsung has already achieved its target of matching its segment market share with its overall DRAM share; HBM4 sales more than tripled quarter-over-quarter in Q3 and accounted for 60% of total HBM revenue.