Huawei said to rely heavily on Samsung and SK Hynix HBM for Ascend 960DT
11/03/2026 — 11/04, 23:17·2 sources (all)·2 reports (all)
Key takeaways
- Citing sources, The Information reported that Huawei has told some customers its upcoming flagship Ascend 960DT chip will draw a substantial…
Background & analysis
According to a Techmeme item published on November 3, 2026, at 11:25, The Information reported, citing sources familiar with the matter, that Huawei recently told some of its clients that a large share of its upcoming flagship chip, Ascend 960DT, will run largely on HBM manufactured by Samsung and SK Hynix. The same report used this case as an illustration of how porous U.S. restrictions on the shipment of AI chips to China can be in practice. So far this is the only report available, and no further developments have been reported since.
AI-generated from 1 reports · updated 2 days ago
Latest turnHuawei has told some customers that its next flagship AI chip, the Ascend 960DT, will rely largely on HBM from Samsung and SK Hynix, The Information reported. US export rules bar the two Korean suppliers from selling high-bandwidth memory to China, and Chinese memory makers cannot yet produce enough of it.
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Huawei has told some customers that its next flagship AI chip, the Ascend 960DT, will rely largely on HBM from Samsung and SK Hynix, The Information reported. US export rules bar the two Korean suppliers from selling high-bandwidth memory to China, and Chinese memory makers cannot yet produce enough of it.
The Next WebAI score 61
Huawei has recently told some customers that a large share of its upcoming flagship Ascend 960DT chips will use HBM made by Samsung and SK Hynix, The Information reported, citing sources. The report uses the arrangement as an example of how porous U.S. restrictions on AI chip shipments to China have proven.
TechmemeAI score 65
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