Samsung Plans to Produce HBM Base Dies for AMD and Others at Taylor Fab
11/04/2026 — 11/04, 10:16·1 sources (all)·1 reports (all)
Key takeaways
- According to Korean media, Samsung Foundry plans to produce HBM base dies for customers like AMD at its second fab in Taylor, Texas, as the…
Background & analysis
On November 4, 2026, the Korean media outlet Maeil Business Newspaper reported, citing a story published the previous day, that Samsung Electronics' foundry business plans to produce HBM base dies for customers including AMD at the second fab within its Taylor, Texas campus. The report notes that the first fab in Samsung's Taylor cluster is set to begin operations within 2026, while the second fab will break ground this month and is expected to come online in 2030.
The report also outlines the shift behind the plan: Samsung Foundry has primarily supplied HBM base dies to Samsung's own memory business, but starting with the HBM4 generation, memory makers' in-house processes are gradually unable to meet the performance requirements of the base die that communicates with the XPU at the bottom of the HBM stack, and future custom HBM designs will need to offload some XPU functions onto the base die. As a result, memory manufacturers have begun placing base die manufacturing orders with external advanced-node foundries. Industry insiders believe that the HBM base dies made at Taylor Fab 2 could go to AMD as well as to AI ASICs that Broadcom builds for its customers.
As of this report, the plan is based on Korean media reporting, and Samsung has not yet issued an official confirmation.
AI-generated from 1 reports · updated 1 day ago
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Samsung Foundry reportedly plans to manufacture HBM base dies for AMD and other clients at its second fab in Taylor, Texas, as advanced HBM4 requirements drive demand for external foundry partnerships.
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